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Equipment and Processes
NFC Equipment and Process List
Access and equipment rates 7/09 - 6/10 [ PDF 85.9kB]
View equipment and process notes using a map of the lab.
- FEI FIB - Focused ion beam etching tool
(coral name: fib)
- FIB SOP [ PDF 395.6kB]
- FIB short cut keys [ PDF 122kB]
- Finding eucentric
- Self-Supporting TEM Lamella
- TEM Lamella Formation [ PDF 437kB]
Mask Maker - NFC staff only system (coral name: opg)- Feature size: 1.5 µm min, and 8 side circle, 10 µm. 4 and 5 inch mask plate sizes in stock. Submitted mask form should be GDS file type format, turn around time is about 2 weeks.
- Mask Making Design Rules [ PDF 32kB]
- Mask Design Submission Form
Raith - E-beam lithography system (coral name: raith)- EBL SOP [ PDF 254kB]
- Micro·Chem Nano™ PMMA Data Sheet [ PDF 1.1MB]
- Micro·Chem Nano™ SU-8 2000 Data Sheet [ PDF 87kB]
Process info for this section
- CEE - Photo resist dispensing system
(coral name: spinner-cee1)
- SOP [ PDF 18kB]
Headway - Photo resist dispensing system (coral name: spinner-headway)- SOP [ PDF 16kB]
MA-6 - Contact aligner system (coral name: ma6)- SOP [ PDF 728kB]
- Wafer Dicing: A Beginners Guide [ PDF 8kB]
MA-BA-6 - Contact aligner system that can do backside aligning (coral name: maba6)- SOP [ PDF 728kB]
- Front to back aligning SOP [ PDF 164kB]
- Wafer Dicing: A Beginners Guide [ PDF 8kB]
MJB-3 - Contact aligner system (coral name: mjb-3)- SOP [ PDF 36kB]
- Wafer Dicing: A Beginners Guide [ PDF 8kB]
Oriel - Photo resist exposing system (coral name: oriel)- SOP [ PDF 10kB]
Oven and Hot Plates - Photo resist baking system- Pre-bake oven SOP [ PDF 8kB]
- Soft-bake oven SOP [ PDF 8kB]
- Hard-bake oven SOP [ PDF 8kB]
- Blue M exhausted bake oven [ PDF 11kB]
- Hotplate SOP (Pre-bake, Soft-bake, and Hard-bake) [ PDF 17kB]
YES 310 - Image reversal processing system (coral name: yes-310)- SOP [ PDF 477kB]
- ALD - Atomic layer deposition system (coral name: ald)
- SOP [ PDF 461kB]
LPCVD - Low pressure chemical vapor deposition system (coral names: tube32-poly, tube33-nitride, tube 34-lto)- Tube 32 is the Poly deposition tube, which is for both N or P type doped Poly or undoped Poly.
- Tube 33 is a Low Stress Nitride and regular Nitride process tube.
- Tube 34 is a Low Temperature Oxide tube for both undoped and N and P doped films: LTO, PSG, BPSG.
- Tube 31 is not yet running, but will be able to do 6" (150 mm) or 4" wafers for Low Stress Nitride process.
- SOP [ PDF 424kB]
PECVD - Plasma-enhanced chemical vapor deposition system (coral name: pecvd)
- AJA Sputter - RF-DC metal deposition system
(coral name: aja-sputterer)
- SOP [ PDF 160.4kB]
- Deposition Rates [ PDF 11kB]
DC Sputter - DC metal deposition system (coral name: dcsputter)- SOP [ PDF 27kB]
- Uniformity Testing of Sputtered Aluminum on Si [ PDF 124kB]
CHA Evaporator - E-beam deposition system (coral name: ebevap-cha)- SOP [ PDF 395.9kB]
- SOP - Changing Fixtures [ PDF 3.3MB]
- Materials [ PDF 17.9kB]
- Equipment Video [Windows Media 91MB]
- How to become a CHA user
- Example of Metal Step Coverage
- Thin film adhesion info
Temescal E-beam - E-beam deposition system (coral name: ebevap-temescal)- SOP [ PDF 147kB]
- Thin film adhesion info
Varian E-beam - E-beam deposition system (coral name: ebevap-varian)- SOP [ PDF 28kB]
Thermal evaporator - Metal evaporation deposition system (coral name: thermevap)- SOP [ PDF 18kB]
- Asher - Oxygen Plasma cleaning system
(coral name: asher)
- SOP [ PDF 22kB]
Critical Point Dryer - MEMS drying system (coral name: cpdryer)- SOP [ PDF 20kB]
- Equipment Video [Windows Media 30MB]
- How to become a CPD user
- Example Gallery
Deep Trench Etcher - Silicon etching system (coral name: deeptrench)
ION Mill - Ion etching system (coral name: ionmill)- SOP [ PDF 110.2kB]
STS Etcher - Reactive ion etcher deposition system (coral name: stsetch)
TRION - Reactive ion etching system (coral names: trion1, trion2)- Trion 1 SOP
- Trion 2 SOP [ PDF 21.6kB]
- Trion 2 process notes (Pre-bake, Soft-bake, and Hard-bake)
UVO Cleaner (coral name: uv-ozone-cleaner)- SOP [ PDF 17kB]
- Tylan Furnace Bank - Atmosphere oxidation system (coral names: tube21-ht-oxide, tube22-gate-oxide, tube23-gen-oxide, tube24-alloy)
RTA-1 - Rapid thermal annealing system (coral name: rta-1)
Wafer Saw - Wafer cutting system (coral name: saw)- SOP [ PDF 358.8kB]
- Request Form
- Wafer Dicing: A Beginners Guide
SB6 - Wafer Bonding system (coral name: sb6)
AFM - Atomic force microscope measuring tool (coral name: afm-1)- SOP [ PDF 608.2kB]
- Operation Note
Confocal Microscope - optical profiler designed for fast and non-invasive inspection and measurement of the 3-dimensional geometry of probe marks, probe cards, MEMS, micro lenses and similar micro and nano engineered or precision-machined structures. (coral name: hs-scope)- SOP [ PDF 3.6MB]
CV-IV - Capacitance voltage-current coltage system (coral name: cviv)- SOP [ PDF 85kB]
Gaertner Ellipsometer - Laser based measuring system (coral name: ellipsometer-g)- SOP [ PDF 34.7kB]
Rudolph Ellipsometer - Laser based measuring system (coral name: ellipsometer-r)- SOP [ PDF 14.4kB]
Four Point Probe - Thin film or surface sheet resistance measuring system (coral name: four-point-probe)- SOP [ PDF 12.7kB]
Nanospec-1 - Dielctric film thickness measuring system model 200 (coral name: nanospec-1)- SOP [ PDF 15kB]
Nanospec-2 - Dielctric film thickness measuring system model 200 (coral name: nanospec-2)- SOP [ PDF 15kB]
Stress Test-1 - Wafer stress or warpage system (coral name: stresstest-1)- SOP [ PDF 143.7kB]
- Excel spreadsheet to calculate stress independent of the FSM from the generated 'radius of curvature' data.
Dektak - Profilometer measuring system (coral name: surface-prof)- SOP [ PDF 151kB]
KLA-Tencor P-16 - Surface profile measurement system (coral name: surface-prof-p16)- SOP [ PDF 139kB]
Please refer to the Shortcourse Instructor List to contact the instructor/specialist for more information regarding any equipment.
