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Equipment and Processes
NFC Equipment and Process List
Process rates 7/07 - 6/08
View equipment and process notes using a map of the lab.
- FEI FIB - Focused ion beam etching tool (coral name: fib)
- Mask Maker - NFC staff only system
(coral name: opg)
- Feature size: 1.5 µm min, and 8 side circle, 10 µm. 4 and 5 inch mask plate sizes in stock. Submitted mask form should be GDS file type format, turn around time is about 2 weeks.
- Mask Making Design Rules [ PDF 32kB]
- Mask Design Submission Form
- Raith - E-beam lithography system
(coral name: raith)
- E-beam SOP [ PDF 375kB]
- SEM SOP [ PDF 279kB]
- Micro·Chem Nano&tm; PMMA Data Sheet [ PDF 1.1MB]
- Micro·Chem Nano&tm; SU-8 2000 Data Sheet [ PDF 87kB]
Process info for this section
- CEE - Photo resist dispensing system
(coral name: spinner-cee1)
- SOP [ PDF 18kB]
- Headway - Photo resist dispensing system
(coral name: spinner-headway)
- SOP [ PDF 16kB]
- MA-6 - Contact aligner system
(coral name: ma6)
- SOP [ PDF 728kB]
- Wafer Dicing: A Beginners Guide [ PDF 8kB]
- MA-BA-6 - Contact aligner system that can do
backside aligning (coral name: maba6)
- SOP [ PDF 728kB]
- Front to back aligning SOP [ PDF 164kB]
- Wafer Dicing: A Beginners Guide [ PDF 8kB]
- MJB-3 - Contact aligner system
(coral name: mjb-3)
- SOP [ PDF 36kB]
- Wafer Dicing: A Beginners Guide [ PDF 8kB]
- Oriel - Photo resist exposing system
(coral name: oriel)
- SOP [ PDF 10kB]
- Oven and Hot Plates - Photo resist baking system
- Pre-bake oven SOP [ PDF 8kB]
- Soft-bake oven SOP [ PDF 8kB]
- Hard-bake oven SOP [ PDF 8kB]
- Blue M exhausted bake oven [ PDF 11kB]
- Hotplate SOP (Pre-bake, Soft-bake, and Hard-bake) [ PDF 17kB]
- YES 310 - Image reversal processing system
(coral name: yes-310)
- SOP [ PDF 201kB]
- LPCVD - Low pressure convection vapor deposition
system (coral names: tube32-poly, tube33-nitride, tube 34-lto)
- Tube 32 is the Poly deposition tube, which is for both N or P type doped Poly or undoped Poly.
- Tube 33 is a Low Stress Nitride and regular Nitride process tube.
- Tube 34 is a Low Temperature Oxide tube for both undoped and N and P doped films: LTO, PSG, BPSG.
- Tube 31 is not yet running, but will be able to do 6" (150 mm) or 4" wafers for Low Stress Nitride process.
- SOP [ PDF 424kB]
- PECVD - Plasma enhanced convention vapor deposition system (coral name: pecvd)
- AJA Sputter - RF-DC metal deposition system
(coral name: aja-sputterer)
- SOP [ PDF 178kB]
- Deposition Rates [ PDF 11kB]
- DC Sputter - DC metal deposition system
(coral name: dcsputter)
- SOP [ PDF 27kB]
- CHA Evaporator - E-beam deposition system
(coral name: ebevap-cha)
- SOP [ PDF 416kB]
- SOP - Changing Fixtures [ PDF 9.7MB]
- Materials [ PDF 28kB]
- Equipment Video [Windows Media 91MB]
- How to become a CHA user
- Example of Metal Step Coverage
- Thin film adhesion info
- Temescal E-beam - E-beam deposition system (coral name: ebevap-temescal)
- SOP [ PDF 95kB]
- Thin film adhesion info
- Varian E-beam - E-beam deposition system
(coral name: ebevap-varian)
- SOP [ PDF 28kB]
- Thermal evaporator - Metal evaporation deposition
system (coral name: thermevap)
- SOP [ PDF 18kB]
- Asher - Oxygen Plasma cleaning system
(coral name: asher)
- SOP [ PDF 22kB]
- Critical Point Dryer - MEMS drying system
(coral name: cpdryer)
- SOP [ PDF 20kB]
- Equipment Video [Windows Media 30MB]
- How to become a CPD user
- Example Gallery
- Deep Trench Etcher - Silicon etching system (coral name: deeptrench)
- ION Mill - Ion etching system (coral name: ionmill)
- STS Etcher - Reactive ion etcher deposition system (coral name: stsetch)
- TRION - Reactive ion etching system
(coral names: trion1, trion2)
- Trion 1 SOP
- Trion 2 SOP
- Trion 2 process notes (Pre-bake, Soft-bake, and Hard-bake)
- UVO Cleaner (coral name: uv-ozone-cleaner)
- SOP [ PDF 17kB]
- Tylan Furnace Bank - Atmosphere oxidation system (coral names: tube21-ht-oxide, tube22-gate-oxide, tube23-gen-oxide, tube24-alloy)
- RTA-1 - Rapid thermal annealing system (coral name: rta-1)
- CMP-Oxide - Chemical mechanical polishing for
oxides only system (coral name: cmp-oxide)
- The system is limited in the films it can process. The films are Oxide, Poly, and Nitride only. NO METALS Contact the process specialist before planning to use the system.
- Wafer Saw - Wafer cutting system (coral name: wafersaw)
- SB6 - Wafer Bonding system (coral name: sb6)
- AFM - Atomic force microscope measuring tool (coral name: afm-1)
- CV-IV - Capacitance voltage-current coltage system (coral name: cviv)
- Gaertner Ellipsometer - Laser based measuring system (coral name: ellipsometer-g)
- Rudolph Ellipsometer - Laser based measuring system (coral name: ellipsometer-r)
- Four Point Probe - Thin film or surface sheet resistance measuring system (coral name: four-point-probe)
- Nanospec-1 - Dielctric film thickness measuring system model 200 (coral name: nanospec-1)
- Nanospec-2 - Dielctric film thickness measuring system model 200 (coral name: nanospec-2)
- Stress Test-1 - Wafer stress or warpage system
(coral name: stresstest-1)
- SOP
- Excel spreadsheet to calculate stress independent of the FSM from the generated 'radius of curvature' data.
- Dektak - Profilometer measuring system (coral name: surface-prof)
Please refer to the Shortcourse Instructor List to contact the instructor/specialist for more information regarding any equipment.
