NFC Wafer Saw Request Form

Use this form to place requests with the NFC staff for wafer saw work.  Average process time is about 1 week.

This is the request procedure:

1. Complete and submit this form.
2. Indicate how many wafers with the same size die are to be cut. If the wafers, or dies, are of different sizes, submit a form for each size.
3. Place your wafer, with your name on the container, to be cut in chase 4 behind the saw on the shelf labeled "Incoming Wafers".
4. If you have a drawing or image to help describe the cutting instructions, include it with the wafer.
5. The NFC staff will place the cut wafer on the shelf labeled "Outgoing Wafers" and send you an e-mail when the wafer is done.

If you need to make changes please re-submit this form and indicate that under 'Type of Request'.  Make sure you explain in the comment section the changes that are needed.